CSR8670

CSR8670

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Embedded Flash Solution for Bluetooth Audio Applications

The CSR8670 SoC is an audio system-on-chip (SoC) solution with wireless connectivity, embedded flash memory and integrated capacitive touch sensors, enabling the creation of featur....

more

The CSR8670 SoC is an audio system-on-chip (SoC) solution with wireless connectivity, embedded flash memory and integrated capacitive touch sensors, enabling the creation of featur....

more

The CSR8670 SoC is an audio system-on-chip (SoC) solution with wireless connectivity, embedded flash memory and integrated capacitive touch sensors, enabling the creation of feature rich home entertainment and wearable audio products with a highly compelling user experience and superior audio performance.

The CSR8670 SoC is an audio system-on-chip (SoC) solution with wireless connectivity, embedded flash memory and integrated capacitive touch sensors, enabling the creation of feature rich home entertainment and wearable audio products with a highly compelling user experience and superior audio performance.

CSR8670, Qualcomm Kalimba, Qualcomm aptX, Qualcomm cVc and Qualcomm TrueWireless are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

Product license agreement

Integrated single-chip solution for smaller designs

Application processor, Bluetooth and Bluetooth low energy radios, DSP and memory integrated into a single SoC helps reduce system complexity and eBOM while supporting small form factor designs.

Comprehensive ADK software support for easy application development

The software development environment with integrated Bluetooth and audio applications, reference designs and tuning tools supports reduced development time

High-performance audio with aptX technology

aptX audio technology supports high-quality wireless audio, bringing pro-audio quality to consumer electronic devices.

CSR8670 Block Diagram

Features

  • Bluetooth version 4.2 compliant

  • 80MHz programmable Qualcomm® Kalimba™ DSP with integrated multipoint A2DP and HFP audio applications

  • aptX, aptX Low Latency, MP3, AAC and SBC audio codecs

  • 2-mic cVc 8th Generation voice processing technology with wideband speech

  • Audio tuning suite with audio enhancements and two 5-band EQs

  • GAIA V2 and associated Android & iOS example apps for enhanced connectivity with mobile devices

  • Link Layer Topology support for enhanced multi-device co-existence

  • Stereo ADC with 2 microphone inputs and one line input; support for up to 6 digital microphones; stereo DAC

  • Qualcomm TrueWireless stereo

  • Support for Apple MFi¹ & Apple ANCS for enhanced communication with iOS devices

  • Qualcomm® meloD™ Audio Processing stereo widening technology

  • Compatible with third party solutions available from selected eXtension Program members

Specifications

Bluetooth

Bluetooth Version: Bluetooth 5.0

Bluetooth Radio: +10dBm maximum output power (typical), -90dBm receiver sensitivity (basic rate, typical)

USB

USB Version: USB 2.0 (Full Speed)

USB Support: Supports USB charger detection

DSP

DSP Technology: Qualcomm® Kalimba™ DSP

DSP Clock Speed: 80 MHz

MCU

MCU Clock Speed: 80MHz MCU

General Audio

Audio Technology: Qualcomm TrueWireless™ Technology, Qualcomm® Broadcast Audio technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology, 16 bit audio data path

Qualcomm® aptX™ audio playback support: Qualcomm® aptX™, Qualcomm® eXtension program

Audio Playback

Sampling, Playback: 192kHz

Channel output: 2 analog DAC channels

Audio Recording

Sampling, Record: Up to 192kHz/24bit

Microphone: 2 analog mics, 2 microphone bias generators, Up to 6 digital mics

Power Management

Maximum Input Voltage: 3.3V

Charging

Maximum Current: 200 mA on chip, 500 mA with external transistor

Memory

Flash: 16 MB, Up to 64 MB external flash

RAM: 56 KB RAM

Interface

Supported Interfaces: Master I²C, 1x SPDIF, 1x PCM/I²S, UART

Input/Output

ADC: 2 ADCs

DAC: 2 DACs

Maximum PIOs: 29

PWM (LED): 3

Input

Touch Sensor Inputs: 6 touch sensor inputs

Package

Package Type: VFBGA, WLCSP

Pitch: 0.5mm Pitch

Package Size: 4.7 x 4.8 x 0.6 mm, 6.5 x 6.5 x 1 mm

  1. Qualified up to Bluetooth 5.0 standard.
  2. Up to 192kHz sample rate
  3. WLCSP
  4. VFBGA

Development tools and purchase options.

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CSR8670C-ICXT-H BY QUALCOMM

Chip Product

CSR8670 (CSR8670C-ICXT-R), 79WLCSP, GORDON (1.0.3), TSMC

DB-8670-10068-1A BY QUALCOMM

DEV KIT, DB-8670-10068-1A, CSR8670 DEV BOARD

DK-8670-10060-1A BY QUALCOMM

DEV KIT, DK-8670-10060-1A, CSR8670 DEV KIT

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